Adhesion in Metal–Dielectric Structures after Surface Bombardment with an Ion–Electron Flux

Authored by: Nikolay L. Kazanskiy , Vsevolod A. Kolpakov

Optical Materials

Print publication date:  March  2017
Online publication date:  March  2017

Print ISBN: 9781138197282
eBook ISBN: 9781315279930
Adobe ISBN:

10.1201/b21918-4

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Abstract

Thin metal films (up to 50–100 nm thick) are widely used as masks in vacuum plasma etching of nano- and microelectronic components—for example, in fabricating trenches [34] and DOE microreliefs [1, 2]. Stringent requirements for trenches [34] and DOE microreliefs [1, 2] pose the problem of enhancing mask adhesion: even an insignificant decrease in adhesion leads to a significant undercut of the substrate material along the metal–substrate interface, thereby irreversibly distorting the shape of the structure.

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