Electronic Packaging Approaches for High-Temperature Environments

Authored by: R. Wayne Johnson

Extreme Environment Electronics

Print publication date:  November  2012
Online publication date:  November  2012

Print ISBN: 9781439874301
eBook ISBN: 9781439874318
Adobe ISBN:


 Download Chapter



Electronics packaging provides protection for the semiconductor devices, a means of electrically interconnecting those devices with passive and other components, and a path for heat removal. While multiple options are available, two packaging and interconnection approaches are considered in this chapter:

Single chip packaging and interconnection between the individual packages

Multichip module packaging

Search for more...
Back to top

Use of cookies on this website

We are using cookies to provide statistics that help us give you the best experience of our site. You can find out more in our Privacy Policy. By continuing to use the site you are agreeing to our use of cookies.