Electronic Packaging Approaches for Low-Temperature Environments

Authored by: R. Wayne Johnson

Extreme Environment Electronics

Print publication date:  November  2012
Online publication date:  November  2012

Print ISBN: 9781439874301
eBook ISBN: 9781439874318
Adobe ISBN:

10.1201/b13001-77

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Abstract

The field of electronics packaging ranges from the packaging of a single semiconductor die to the electrical, thermal, mechanical, and physical implementation of an electronic system. An example of a single chip packaged die is shown in Figure 66.1. The package provides mechanical and chemical protection for the die, a means of electrically interconnecting to the die at the next level of system integration and a path for internally generated heat removal. Multiple semiconductor packages are then interconnected on a printed circuit board (PCB) with passive and other components to build a higher-level function (Figure 66.2). Often multiple circuit board assemblies are required to complete the system function.

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