Corrosion Resistance of Lead-Free Solders under Environmental Stress

Authored by: Suhana Mohd Said , Nor Ilyana Muhd Nordin

Semiconductor Devices in Harsh Conditions

Print publication date:  November  2016
Online publication date:  November  2016

Print ISBN: 9781498743808
eBook ISBN: 9781315368948
Adobe ISBN:

10.1201/9781315368948-9

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Abstract

With the enforcement of the Restriction of Hazardous Substances (RoHS) in 2006 within the electronics industry, lead-free solders have steadily gained market share in electronics packaging applications. Prior to this, Sn-Pb solders had been the industrial solder of choice. The soldering technology involving Sn-Pb alloys had been developed and improved over the years, which provided many advantages: high ductility, high wettability, ease of handling and low processing temperatures (Abtew and Selvaduray, 2000). Figure 8.1 shows the trend of lead-free solders replacing the usage of tin–lead solders in recent years.

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