Packaging for Systems in Harsh Environments

Authored by: Marc Christopher Wurz , Sebastian Bengsch

Semiconductor Devices in Harsh Conditions

Print publication date:  November  2016
Online publication date:  November  2016

Print ISBN: 9781498743808
eBook ISBN: 9781315368948
Adobe ISBN:

10.1201/9781315368948-8

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Abstract

The field of industrial applications which operate in a harsh environment has increased significantly. Against this background, this chapter gives an overview of the possible materials which allow operation under different harsh environment conditions, such as thermal, chemical, electromagnetic and high-pressure loads. For each application, different materials can be used, such as ceramics, metals or silicon. Every material needs a specific fabrication technology. which is described in the following.

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