Mixed CNT Bundled Through Silicon Vias

Authored by: Brajesh Kumar Kaushik , Vobulapuram Ramesh Kumar , Manoj Kumar Majumder , Arsalan Alam

Through Silicon Vias

Print publication date:  August  2016
Online publication date:  November  2016

Print ISBN: 9781498745529
eBook ISBN: 9781315368825
Adobe ISBN:

10.1201/9781315368825-6

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Abstract

In highly scaled three-dimensional technology, the overall performance and reliability of a chip is strongly dependent on the self and coupling parasitics of through silicon vias (TSVs) and interconnects rather than the transistor logic. Therefore, it is essential to reduce the parasitics, and therefore delay and crosstalk, for efficient performance of future high-speed interconnects and TSVs. The performance of any TSV is primarily dependent on the choice of the filler material used. Recently, mixed carbon nanotubes (CNTs) have emerged as an interesting choice for filler material due to their lower thermal expansion, electromigration, higher mechanical stability, thermal conductivity, and current-carrying capability [18].

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