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Material or Process Book or Chapter Title Author or Editor Publication dates

Through Silicon Vias

Materials, Models, Design, and Performance

Authored by: Brajesh Kumar Kaushik , Vobulapuram Ramesh Kumar , Manoj Kumar Majumder , Arsalan Alam

Print publication date:  August  2016
Online publication date:  November  2016

Print ISBN: 9781498745529
eBook ISBN: 9781315368825
Adobe ISBN:

10.1201/9781315368825
 Cite  Marc Record

Book description

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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