Novel Platforms and Applications Using Three-Dimensional and Heterogeneous Integration Technologies

Authored by: Kuan-Neng Chen , Ting-Yang Yu , Yu-Chen Hu , Cheng-Hsien Lu

3D Integration in VLSI Circuits

Print publication date:  April  2018
Online publication date:  April  2018

Print ISBN: 9781138710399
eBook ISBN: 9781315200699
Adobe ISBN:

10.1201/9781315200699-8

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Abstract

With the growing demands of high computing and Internet of Things (IOT) applications, high IO counts with fast signal transmission speed and variety integration ability become equally significant in current semiconductor development. Platforms based on 3D advanced packaging and integration can provide such solutions to high speed, low power, small form factors, and heterogeneous integration requirements. Advanced applications that have been successfully manufactured such as graphics processing units (GPU) and mobile processers adopt key technologies of 3D integration and advanced packaging such as fan-out scheme, whereas advanced complementary metal oxide semiconductor (CMOS) image sensors use through-silicon via (TSV) and fine-pitch Cu direct bonding. Other than these applications, 3D integration and heterogeneous technologies create many opportunities and a whole new world for advanced systems, which were difficult to be fulfilled in the past. This chapter describes examples of novel platform and application demonstration, including optical components, pressure sensors, and bioneural applications.

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