Challenges in 3D Integration

Authored by: M. Koyanagi , T. Fukushima , T. Tanaka

3D Integration in VLSI Circuits

Print publication date:  April  2018
Online publication date:  April  2018

Print ISBN: 9781138710399
eBook ISBN: 9781315200699
Adobe ISBN:

10.1201/9781315200699-4

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Abstract

Heterogeneous 3D integration technology has increasingly attracted much attention as it is indispensable for Internet of Things (IoT). Low-power consumption, small form factor, and multifunctionality are required for embedded devices in IoT. Heterogeneous 3D integration can provide these embedded devices with low-power consumption, small form factor, and multifunctionality. We have developed new heterogeneous 3D integration and system integration technologies using self-assembly to achieve multichip-to-wafer stacking with high throughput and high precision. Furthermore, we are challenging to develop new technologies such as DSA through-silicon vias (TSVs) and Cu nanopillar (CNP) hybrid bonding for future 3D LSIs with high-density TSVs and microjoints.

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